Feature
It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame.
It is the multi-functional prober which performs transfer and testing on a frame as well as wafer with only one click of button by optional function.
Optimization of correction value is realized by the application which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.
Option
8/12 inch wafer transfer dual mechanism
8 inch frame transfer mechanism
Multiple barcode management
FFU to realize clean testing environment
Hinge-type manipulator for test-head
High-temperature testing environment
Ultra-high magnification color optical system
Needle track inspecting function
PLP testing for diced 300mm square
PLP testing for up to 330mm square
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