Feature
Improved high rigidity and high speed operation technology contribute to the better precision and throughput.
Variety of options enables all kinds of wafer tests that are not standard in this industry.
Option
Testing environment to adopt from ultrahigh to low temperature
Hinge-type manipulator for test-head
Transfer of warpage and ultrathin wafer by the special transfer mechanism
FFU to realize clean testing environment
Low noise testing environment
High-voltage testing environment
Wide variety of network environment
Needle track inspecting function
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