Feature
It performs transfer and testing on 5 to 8 inch wafer. (UF200R)
It performs transfer and testing on 4 to 8 inch wafer. (UF190R)
Adapts MMI, which is the same as UF2000
Variety of options enables all kinds of wafer tests that are not standard in this industry.
Option
Testing environment to adopt from low to high temperature (UF190R is available only for high temperature)
Testing environment for 4-inch wafer (UF200R)
Hinge-type manipulator for test head (UF200R)
Special transfer mechanism for warpage and ultra-thin wafers
MEMS transfer by dedicated mechanism
Micro current testing environment
High voltage testing environment
Wide-variety of network environment
High-speed needle mark inspecting function
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